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“New electronic devices begin with new electronic components; new electronic components begin with new materials...” Based on that concept, Murata has created functional ceramic materials with outstanding characteristics. And we continuously further advance our technology through the development of new materials, with even better characteristics.,facebook free slots

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Materials technology related to composition, crystal structure and simulation modeling of electrical properties (first-principles calculation).,texas poker online with friends

Core shell structure of dielectric materials

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2004 - Conventional process

2014 - New process

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MLCC layer thickness reduction

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Thin internal electrodes

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Precise control of firing temperatures and atmosphere to produce desired crystal structures in electro ceramics.,best site to play blackjack online

Before and after sintering

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Physical and chemical methods, including lithography and etching technologies, to form thin layers or films up to sub-micron levels.,poker sites that use paypal

Comb finger (MEMS technology)

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Metal surface control techniques

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High precision molding and shaping technology using injection molding, pressing and other mechanical techniques to create complex structures with high dimensional accuracy.,best free poker sites to win real money

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From single-function components to modules and on to total solution proposals, the value that Murata has provided over the years continues to evolve. We are involved in development of the technologies and products that can promptly respond to customer needs with an eye on the future.,casino roulette download

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Design techniques for high frequency (up to 60 GHz) components, devices and modules taking into account the complex electromagnetic coupling between circuits, elements and parasitic components.,texas poker online with friends

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Inductor element structures

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Technology that achieves system design utilizing both circuit and embedded software design. The circuit design segment uses discrete analog and digital technology or custom IC technology. The embedded software segment utilizes algorithms and device driver software and middleware to support networking requirements.,virtual group poker

Custom IC design

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Cracks from mechanical stress to boards and noise from vibration of the capacitors are design issues.

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Technology utilizing computer-aided numerical analysis and modeling in areas of electromagnetic field analysis, thermal and stress analysis.,bet online blackjack

Thermal analysis simulation of a power module.

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Thanks to our own production facilities and strong manufacturing (monozukuri) expertise, we possess numerous technologies and know-how to mass-produce products stably and efficiently.,roulette online for free game

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Technologies of back-end process to achieve downsizing and high reliability of devices, for example fine pitch bonding, high heat-resistant joining and specific sealing methods.,crown casino blackjack

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Production lines

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Failure point detection in an ASIC by micro-probers combined with FE-SEM.

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All technologies are directly in line with our markets and customers. Murata’s technologies are closely coordinated and integrated from materials to products. All technological departments aim at the same direction as our customers and try to propose new values. Murata’s strength comes from keeping our direction in line with our customers.,largest poker sites

See more details about Integrated Production System